干法刻蚀技术*，在芯片制造的过程中，硅片表面图形的形成主要依靠光刻和刻蚀两大模块。光刻的目的是在硅片表面形成所需的光刻胶图形，刻蚀则紧接其后地将光刻胶的图形转移到衬底或衬底上的薄膜层上。随着特征尺寸要求越来越小，对光刻和刻蚀的要求也越来越高。通常一个刻蚀工艺包含以下特性：良好的刻蚀速率均匀性(Uniformity)，不仅仅是片内的均匀性(WithinWafer)，还包括片与片之间(WafertoWafer)，批次与批次之间(LottoLot)。高选择比(HighSelecti...

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Lift-offprocessinmicrostructuringtechnologyisamethodofcreatingstructures(patterning)ofatargetmaterialonthesurfaceofasubstrate(ex.wafer)usingasacrificialmaterial(ex.Photoresist).Itisanadditivetechniqueasopposedtomoretraditionalsubtractingtec...